NEXCLEAN GEMINI SERIES

Plasma-Wet Abatement Systems

High-efficiency point-of-use gas abatement systems for semiconductor, solar and flat-panel display manufacturing, with treatment capacities from 600 LPM to 3,000 LPM.

Explore Product Models
600–3,000 LPM Treatment capacity
Dual-Stage Plasma and wet treatment
Point-of-Use Process exhaust abatement
PW600 & PW3000 Available configurations
PLASMA-WET TECHNOLOGY

Effective Treatment for Demanding Process Gases

NexClean Gemini plasma-wet abatement systems use high-temperature DC arc plasma to thermally decompose stable and hazardous process gases.

After plasma treatment, the exhaust passes through wet washing and filtration stages that help capture water-soluble gases, reaction byproducts, particulates and water mist.

  • Designed for semiconductor Etch and CVD processes
  • Suitable for solar and photovoltaic manufacturing
  • Supports flat-panel display production
  • Standard and high-volume treatment capacities
NexClean Gemini PW600 and PW3000 plasma-wet abatement systems
TREATMENT PROCESS

How Plasma-Wet Abatement Works

Two complementary treatment stages help manage difficult process gases and their reaction byproducts.

01

Plasma Decomposition

Process gases enter the reaction chamber, where high-temperature plasma provides intense localised energy to break down stable compounds such as CF₄, NF₃ and SF₆.

02

Wet Scrubbing

Post-decomposition gases pass through wet washing and filtration stages that help capture water-soluble reaction byproducts, particles and water mist.

KEY BENEFITS

Why Choose NexClean Gemini?

Plasma-wet technology provides scalable point-of-use treatment for demanding semiconductor and advanced manufacturing processes.

01

Dual-Stage Treatment

Plasma energy decomposes difficult gases before wet scrubbing manages soluble gases and reaction byproducts.

02

Wide Operating Range

Capacities range from 600 LPM for standard applications to 3,000 LPM for high-volume exhaust streams.

03

Compact Integration

Space-efficient configurations support integration into semiconductor sub-fab and manufacturing facilities.

04

Utility Management

Controlled nitrogen, process cooling water and compressed dry air requirements help manage operating costs.

INDUSTRY APPLICATIONS

Plasma-Wet Abatement Applications

Engineered for process exhaust treatment across advanced manufacturing environments.

Semiconductor wafer manufacturing facility

Semiconductor Manufacturing

Point-of-use treatment for Etch and CVD processes involving perfluorinated and other hazardous process gases.

Solar photovoltaic panel manufacturing

Solar and Photovoltaic

High-throughput gas abatement for coating, deposition and solar-cell fabrication processes.

Flat-panel display manufacturing process

Flat-Panel Display

Scalable process-gas treatment for large-area substrate and display-panel manufacturing operations.

PROCESS GAS TREATMENT

Designed for Critical Process Gases

The appropriate configuration depends on gas type, concentration, exhaust flow and process conditions.

CF₄ NF₃ SF₆ SiH₄ NH₃
PRODUCT RANGE

NexClean Gemini Plasma-Wet Models

Compare the compact PW600 with the higher-capacity PW3000.

NexClean Gemini PW600 plasma-wet abatement system
600 LPM

NexClean Gemini PW600

A compact plasma-wet abatement system for standard-capacity semiconductor, solar and display manufacturing applications.

TypePlasma-Wet
Capacity600 LPM
Dimensions920 × 835 × 1,906 mm
Weight540 kg
Inlets6 × KF40
Process exhaustISO 100
Cabinet exhaustISO 100
Target gasesCF₄, NF₃, SF₆ and others
NexClean Gemini PW3000 high-capacity plasma-wet abatement system
3,000 LPM

NexClean Gemini PW3000

A high-throughput plasma-wet abatement system for larger process exhaust flows and demanding fabrication lines.

TypePlasma-Wet
Capacity3,000 LPM
Dimensions1,300 × 1,135 × 2,030 mm
Weight750 kg
Inlets4–8 × KF40 or 4–6 × KF50
Process exhaustISO 160
Cabinet exhaustISO 100
Target gasesCF₄, NF₃, NH₃, SF₆, SiH₄ and others

Specifications and suitable gas configurations should be confirmed according to actual process and facility requirements.

FREQUENTLY ASKED QUESTIONS

Plasma-Wet Abatement FAQs

What is a plasma-wet abatement system?

It uses high-temperature plasma to decompose process gases before passing the exhaust through wet scrubbing stages that capture soluble byproducts and particles.

Which industries use plasma-wet abatement?

Plasma-wet systems are commonly used in semiconductor, solar, photovoltaic and flat-panel display manufacturing, including Etch and CVD applications.

What is the difference between PW600 and PW3000?

The PW600 provides a 600 LPM treatment capacity in a more compact configuration. The PW3000 supports up to 3,000 LPM for higher-volume process exhaust streams.

How do I select the correct system?

Selection depends on gas types, concentrations, exhaust flow, process equipment, inlet configuration and available utilities. Camda Engineering can review these requirements.

TALK TO OUR TECHNICAL TEAM

Looking for a Plasma-Wet Abatement Solution?

Share your process gas types, exhaust flow, inlet requirements and facility conditions with our technical team.