NexCLEAN Gemini Series:
Plasma-Wet Abatement
Systems (PW600 – PW3000)
What is the NexCLEAN Gemini Series?
A High-efficiency plasma-wet abatement system engineered for semiconductor and solar manufacturing.
It utilizes high-temperature DC arc plasma to thermally decompose hazardous greenhouse gases (PFCs like CF4, NF3, SF6) and pyrophoric gases (SiH4), followed by wet scrubbing to neutralize acidic byproducts.
Available in capacities ranging from 600 LPM to 3000 LPM, the Gemini series provides a Point-of-Use (POU) solution that ensures zero-emission compliance for high-throughput fabrication lines.
Why Choose
NexCLEAN Germini?
- High-Efficiency Destruction: Targeted removal of Perfluorinated Compounds (PFCs) and Global Warming Gases including CF4, NF3, SF6, NH3, and SiH4.
- Scalable Throughput: Options ranging from 600 LPM for standard applications to 3000 LPM for high-volume manufacturing.
- Compact Footprint: High-density design minimizes cleanroom floor space requirements.
- Intelligent Utilities: Optimized consumption of Nitrogen (N2), Process Cooling Water (PCW), and CDA to lower operating costs.
Industry Applications
We are Committed to Your Performance
Semiconductor Manufacturing
Ideal for Etch and CVD (Chemical Vapor Deposition) processes involving perfluorinated compounds (PFCs).
Solar/ Photovoltaic (PV) Production
High-throughput abatement for texturing and coating processes in solar cell fabrication.
Flat-Panel Display (FPD)
Scalable gas treatment solutions for large-area substrate processing.
Critical Process Gas Treatment
Effectively handles a wide range of hazardous gases including:
- Global Warming Gases (PFCs): CF4, NF3, SF6.
- Pyrophoric & Toxic Gases: SiH4 (Silane), NH3 (Ammonia).
BENEFITS
Why Leading Fabs Choose the
Plasma-Wet Configuration?
Dual-Stage
Destruction:
Combines intense plasma energy for thermal decomposition of stable gases with wet scrubbing for water-soluble byproducts.
Superior Decomposition Efficiency:
Uses localized high-intensity heating to break down difficult gases like SF6 that standard thermal units may struggle with.
Wide Operating
Range:
Modular options ranging from 600 LPM (PW600) for standard applications up to 3000 LPM (PW3000) for high-volume exhaust streams.
Space-Saving
Design:
Compact footprint allows for easy integration into sub-fab layouts (920mm width for PW600 up to 1300mm for PW3000).
Intelligent Utility Management:
Optimized consumption of Nitrogen (N2) and Process Cooling Water (PCW) ensures lower Cost of Ownership (CoO).
Our Product Line
NexClean Germini PW600
- The abatement used intense energy sources to generate the plasma, inducing thermal decomposition in targeted gases through intense localized heating.
- This technique finds significant use in Semiconductor, Flat-Panel Display and Solar processing.
- Post decomposition gases are typically managed using wet scrubbing.
| CONTENTS | SPECIFICATIONS |
|---|---|
| Type | Plasma-Wet |
| Dimension | 920 (W) x 835(D) x 1906(H) (mm) |
| Capacity | 600LPM |
| Weight | 540 kg |
| Inlet | 6*KF40 |
| Process Exhaust | ISO 100 |
| Cabinet Exhaust | ISO 100 |
| Drain | Power Drain |
| Gas | CF4,NF3,SF6,etc. |
NexClean Germini PW1500
- The abatement used intense energy sources to generate the plasma, inducing thermal decomposition in targeted gases through intense localized heating.
- This technique finds significant use in Semiconductor, Flat-Panel Display and Solar processing.
- Post decomposition gases are typically managed using wet scrubbing.
| CONTENTS | SPECIFICATIONS |
|---|---|
| Type | Heat-Wet |
| Dimension | 1100(W) x 1350(D) x 2000(H) (mm) |
| Capacity | 1500LPM (H2 300 LPM max.) |
| Weight | 850 kg |
| Inlet | 4*KF50 |
| Process Exhaust | ISO 160 |
| Cabinet Exhaust | ISO 150 |
| Drain | Power Drain |
| Gas | SiH4,NH3,DCS,H2,CH4,PH3 |
NexClean Germini PW3000
- The abatement used intense energy sources to generate the plasma, inducing thermal decomposition in targeted gases through intense localized heating.
- This technique finds significant use in Semiconductor, Flat-Panel Display and Solar processing.
- Post decomposition gases are typically managed using wet scrubbing.
| CONTENTS | SPECIFICATIONS |
|---|---|
| Type | Plasma-Wet |
| Dimension | 1300 (W) x 1135(D) x 2030(H) (mm) |
| Capacity | 3000LPM |
| Weight | 750 kg |
| Inlet | 4-8*KF40 4-6*KF50 |
| Process Exhaust | ISO 160 |
| Cabinet Exhaust | ISO 100 |
| Drain | Power Drain |
| Gas | CF4,NF3,NH3,SF6,SiH4,etc. |
